Bump connections and wire bonds of 3D CMOL FPGA can serve as

Download scientific diagram | Bump connections and wire bonds of 3D CMOL FPGA can serve as programming communication channels and IOs respectively. from publication: 3D integration of CMOL structures for FPGA applications | In this paper, a novel 3D CMOS nanohybrid technology, 3D CMOL, is introduced to establish FPGA chips. By combining two leading technologies, hybrid CMOS/nanoelectronic circuit (CMOL) and 3D integration, 3D CMOL can provide a feasible and more efficient fabrication/assembly | FPGA, CMOS and FPGAs | ResearchGate, the professional network for scientists.

3D Integration of CMOL Structures for FPGA Applications

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Bump connections and wire bonds of 3D CMOL FPGA can serve as

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Bump connections and wire bonds of 3D CMOL FPGA can serve as

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3D Integration of CMOL Structures for FPGA Applications

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